번호 | 연도 | 과제책임자 | 소속 | 발표명 | 다운로드 | 조회수 |
55 |
2024.01.29 ~ 02.01 |
Peter Liu (Ph.D.) |
Auburn University |
Physics-Informed Machine Learning for Solder Design and Reliability Prediction in Electronics |
107 |
|
---|---|---|---|---|---|---|
54 |
2024.01.29 ~ 02.01 |
Sierra Freitas PhD, Weiyang Li, William P. Harris |
Dartmouth College |
Recent Developments and Challenges in Battery Safety with Solid State Technology |
122 |
|
53 |
2024.01.29 ~ 02.01 |
Eddie Quinn |
U.S. Department of Defense |
Evaluation of surface mount technology reliavility of Aerosol-Jet printed landing pads for surface mounted devices |
112 |
|
52 |
2024.01.29 ~ 02.01 |
Pradeep Lall, Ved Soni, Jinesh Narangaparamil, Shriram Kulkarni |
Auburn University |
Realization of Sustainable Additively Printed Circuits using Aerosol-Jet Inkjet and Direct-Write Processes |
117 |
|
51 |
2024.01.29 ~ 02.01 |
Dr. Daryl Santos |
Watson Institue for System Excellence / Binghamton University - State University of Newyork |
An Improved Automated SPI Data Analysis Report Generator for Printed Circuit Board Assembly |
104 |
|
50 |
2024.01.29 ~ 02.01 |
Ron Lasky (Ph.D , PE) |
Indium Corporation |
Recent Developments in Low Temaerature Solders |
110 |
|
49 |
2024.01.29 ~ 02.01 |
Balazs Illes |
Budapest University of Technology and Economics |
Development and chaacterization of Sn99Ag0.3Cu0.7-(ZrO2/CuO/TiO2) nano-composite solder allys |
109 |
|
48 |
2024.01.29 ~ 02.01 |
Hongwen Zhang (Ph.D.), Tyler Richmond, Huaguang Wang (Ph.D.), Framcis Mutuku (Ph.D.) |
Indium Corporation |
The Challenge of Lower Temperature Soldering for Large Ball-Grid Array Board-Level Assembly Process |
117 |
|
47 |
2024.01.29 ~ 02.01 |
Prabjit Singh |
IBM Corporation |
In situ study of eutectic tin-bismuth eletromigration |
123 |
|
46 |
2024.01.29 ~ 02.01 |
Dr. Daryl Santos |
Watson Institue for System Excellence / Binghamton University - State University of Newyork |
Automatic Stencil Design Aperture Openings for BGAs to Mitigate Reflow Defects Caused by Chip Dynamic Warpage Using Numerical Shadow Moire Data |
101 |
|
45 |
2024.01.29 ~ 02.01 |
Gregory A.Harris Ph.D., P.E. / Ashley C. Yarbrough, Ph.D. |
Auburn University / Lipscomb University |
Industry 4.0 Technology Adoption Issues for SMMs and the Role of AI to Improve Adoption Rates |
126 |
|
44 |
2024.01.29 ~ 02.01 |
Justin Worden |
Rockasolutions / Vice President Sales & Marketing |
SMTA 학회 발표 자료_Elevating Excellence in High-Reliability Electronics: The Personal and Lasting Legacy of Clean PCBs |
109 |
|
43 |
2024.01.29 ~ 02.01 |
Mike Konrad |
Aqueous Technologies Fonder / CEO |
SMTA 학회 발표 자료_Decoding the New IPC Cleanliness Testing Standard |
101 |
|
42 |
2024.01.29 ~ 02.01 |
Adam Klett |
KYZEN Corporation |
SMTA 학회 발표 자료_Evaluation of Techniques for Intentional Contamination of PWB Substrates for Quantitative Cleanliness Analyses |
107 |
|
41 |
2024.01.29 ~ 02.01 |
Jessica Lasky-Su |
SCD |
SMTA 학회 발표 자료_Using AI to inform you health |
132 |
|
40 |
2024.01.29 ~ 02.01 |
Hailey Mullen |
Dartmouth College |
SMTA 학회 발표 자료_It Ain`t Gonna Happen: Interplanetary Colonization |
108 |
|
39 |
2024.01.29 ~ 02.01 |
Keith Bryant |
K.B. Consultancy |
SMTA 학회 발표 자료_Electronics manufacturing, a global perspective |
102 |
|
38 |
2024.01.29 ~ 02.01 |
Pradeep Lall |
Auburn University, MacFarlane Endowed Distinguished professor |
SMTA 학회 발표 자료_Artificial Intelligence-Based Methods for Assessment of Accrued Damage and Remaining Use-Life in Automotive Underghood Electronics |
117 |
|
37 |
2024.01.29 ~ 02.01 |
Jan Fröhlich |
Friedrich-Alexander-Universität Erlangen-Nürnberg |
SMTA 학회 발표자료_ Reliable and Automated Connection of Printed Electronics to the Aviation Electrical System |
110 |
|
36 |
2024.01.29 ~ 02.01 |
Ryan Gamble |
Intraratio Corporation |
SMTA 학회 발표 자료_The Data Revolution Within Electroics Manufacturing : Digitization + AI/ML |
120 |